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Advantages of introducing clean transfer robot ACTRANS
OFH-4100 Series
For wafers from 50 to 300mm
Aligner compatible with high-speed alignment
Features
- Suction holding type aligner that boasts the industry's fastest alignment time.
- Capable of multiple-size wafer alignment by command.
- Can stop the orientation flat portion and notch portion at the designated position.
- Alignment of quartz wafers is also available.
Operation flow
Specifications*1
| Model | OFH-4100 | OFH-4101 | OFH-4102 | OFH-4103 | |
|---|---|---|---|---|---|
| Applicable Wafer Size (※1) | 200-300mm | 150-200mm | 100-200mm | 50-150mm | |
| Repeatability | XY:±0.1mm、θ:±0.2° | ||||
| Alignment Time | 1.8sec. (※2) | ||||
| Cleanliness | ISO Class 3 (ISO-14644） | ||||
| Mass | 8kg | ||||
| Utilities | Vacuum | -80KPag or less, 10NL/min | |||
| Power supply | 24 VDC 3A | ||||
| Environment | Temperature | 15-25℃ | |||
| Humidity | 60% or less (No condensation) | ||||
※1 The OFH-4100Q series is available for quartz wafers. Contact us for details.
※2 In the case of a 50mm wafer, the alignment time is 2.5 sec.
EG-303 Series
For 300mm wafers
Edge grip type aligner never makes
contact with wafer back sides
Features
- High-precision centering by the edge grip method using three movable claws.
- The optional buffer port minimizes the waiting time of the robot during alignment.
- Can stop the notch portion at the designated position.
- Command option to move the wafer ID portion to a customer-prepared camera position.
Operation flow
1. Turn on the power.
By the “return to origin” command, the EG moves the arm section to the “position where a transfer robot can place and remove wafers on/from the EG.”
2. Place a pre-alignment wafer on the wafer station using a transfer robot.
3. For reading the wafer ID on the EG, execute the “move to OCR position” command.
The EG aligns the wafer with the “OCR readout angle” and moves it to the “OCR position.” Perform OCR readout operation with your system.
4. Execute the “alignment” command.
The EG aligns the wafer with the “alignment angle” and places it on the wafer station. After that, the EG moves the arm section to the position where the transfer robot can access the EG.
5. Remove the aligned wafer from the wafer station using the transfer robot.
Specifications
| Model | EG-303 | |
|---|---|---|
| Applicable Wafer Size | 300mm | |
| Repeatability | High Accuracy Mode | XY: ±0.05mm θ: ±0.075° |
| Normal Mode | XY: ±0.2mm θ: ±0.1° | |
| Alignment Time | High Accuracy Mode | Average 7.5sec. |
| Normal Mode | Average 3.5sec. | |
| Cleanliness | ISO Class 3 (ISO-14644） | |
| Mass | 7kg | |
| Utilities | Power supply | 24 VDC 3A |
| Environment | Temperature | 0-40℃ |
| Humidity | 70% or less (No condensation) | |
Other Clean Transfer Robots
Vacuum Robots
Cylindrical coordinate type standard UT-VFX3000NM
Cylindrical coordinate type high-payload UT-VFX4000NM
Cylindrical coordinate type high heat-resistance UTVW-R2800H
Cylindrical coordinate type high-precision, low-vibration UT-VDX3000NS
Cylindrical coordinate type high-speed, low-vibration UT-VDW3000HS
SCARA type high-precision, low-vibration UT-VSW3000NS
