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Advantages of introducing clean transfer robot ACTRANS
UTVW-R2800H
For wafers up to 300mm
High-precision,
low-vibration double-arm vacuum robot
for high-temperature processes
Features
- Double-arm type equipped with Z-axis as standard.
- Contributes to throughput improvements by transferring wafers with low vibration with the adoption of a direct drive motor on the θ-axis.
- Equipped with wafer center misalignment correction function.
- Adopted in front-end processes of semiconductor manufacturing. Especially compatible with high-temperature processes, such as CVD and RTP.
Compatible with high-temperature processes, reducing takt time
The table below shows examples of takt time elapsing from the time when a processed wafer is replaced with a pre-processing wafer in PM (process module) and the processed wafer is replaced with the pre-processing wafer placed in LL (load lock module) to the time when the robot is in standby in front of the process module.
Transfer takt time table between PM and LL (arranged 180° opposite each other)
| Operating time (sec.) | ||||||
|---|---|---|---|---|---|---|
| Access module | Command | Hand(s) selected | Motion | Stroke |
PAD-less (0.15G)* |
PAD-included (0.3G)* |
| PM | GET_RETRACT | H1 | Arm extension | X: 670mm | 1.5 | 1.2 |
| Z-axis up | Z: 8mm | 0.8 | 0.8 | |||
| Arm retraction | X: 670mm | 1.5 | 1.2 | |||
| PUT_WAIT | H1→H2 | Hand change | Z: 14mm | 1.0 | 1.0 | |
| PUT_RETRACT | H2 | Arm extension | X: 670mm | 1.5 | 1.2 | |
| Z-axis down | Z: 8mm | 0.8 | 0.8 | |||
| Arm retraction | X: 670mm | 1.5 | 1.2 | |||
| GET_WAIT | Rotation | θ: 180deg | 2.7 | 2.0 | ||
| LL | GET_RETRACT | H2 | Arm extension | X: 620mm | 1.5 | 1.1 |
| Z-axis up | Z: 8mm | 0.8 | 0.8 | |||
| Arm retraction | X: 620mm | 1.5 | 1.1 | |||
| PUT_WAIT | H2→H1 | Hand change | Z: 14mm | 1.0 | 1.0 | |
| PUT_RETRACT | H1 | Arm extension | X: 620mm | 1.5 | 1.1 | |
| Z-axis down | Z: 8mm | 0.8 | 0.8 | |||
| Arm retraction | X: 620mm | 1.5 | 1.1 | |||
| GET_WAIT | Rotation | θ: 180deg | 2.7 | 2.0 | ||
| Total | 22.6 | 16.4 | ||||
| Equipment throughput (standard) | 159 | 220 | ||||
*Pads are made of non-slip resin material that makes contact with the back side of
wafers. (Heat-resistant specification is 260°C or less.)
PAD-less motion corresponds to commands where acceleration of 0.15G or less is applied
to wafers.
PAD-included motion corresponds to commands where acceleration of 0.3G or less is
applied to wafers.
Advantages of introducing clean transfer robot ACTRANS
Specifications*1
| Model | UTVW-R2800H | |
|---|---|---|
| Robot Type | axis Cylindrical Coordinate | |
| Operation Range | X1, X2-axis | 670mm |
| θ-axis | 330° | |
| Z-axis | 50mm | |
| Max. Operation Speed | X1, X2-axis | 1400mm/sec. |
| θ-axis | 145°/sec. | |
| Z-axis | 50mm/sec. | |
| Operating Time | X1, X2-axis | 1.2sec./670mm |
| θ-axis | 2.0sec./180° | |
| Z-axis | 1.5sec./50mm | |
| Repeatability | XYZ direction: ±0.1mm each (3σ) (※2) | |
| Payload | 2.5kg (※3) | |
| Cleanliness | ISO Class 3 (ISO-14644) | |
| Mass | 85kg | |
| Environment | Temperature | 15-40℃ (Atm. side)/15-80℃ (Vacuum Seal Unit) |
| Humidity | 20-70%, No condensation | |
| Pressure | Atmospheric pressure ～ 10-6Pa | |
※1 Transfer performance differs from the standard when options are added.
※2 Under our evaluation conditions
※3 Total mass of hand base, hand, and wafer
Q&A - Frequently Asked Questions -
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Cylindrical coordinate type high-speed, low-vibration UT-VDW3000HS
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