UTW-REH5500
High-speed model
High-speed transfer at 450WPH contributes
to equipment throughput improvements
Features
- Performs wafer replacement motion in sequence between one cassette and two stages in 8 seconds.
- Ideal for equipment that requires high-speed transfer, such as a sorter, diffusion furnace, etching device, or ion implanter.
- A wafer sensor/mapping sensor can be mounted.
General motion pattern
- Removes one unprocessed wafer from the FOUP.
- Moves to the front of the aligner.
- Replaces the unprocessed wafer with the aligned wafer.
- Moves to the equipment stage.
- Replaces the aligned wafer with the processed wafer.
- Moves to the front of the FOUP.
- Places the processed wafer into the FOUP.
Since the motion from Step 1 to 7 above can be performed at a rate of 8 seconds/cycle, the maximum number of wafers transferred per hour reaches 450, realizing 450WPH.
Advantages of introducing clean transfer robot ACTRANS
Specifications*1
Model | UTW-REH5500 | |
---|---|---|
Robot Type | 4 axis Cylindrical Coordinate | |
Operation Range | X, A-axis | 500mm |
θ-axis | 340° | |
Z-axis | 300mm | |
Max. Operation Speed | X, A-axis | 1800mm/sec. |
θ-axis | 360°/sec. | |
Z-axis | 500mm/sec. | |
Operating Time | X, A-axis | 0.5sec./500mm |
θ-axis | 1.2sec./340° | |
Z-axis | 0.8sec./300mm | |
Repeatability | XYZ direction ±0.1mm each | |
Payload | 0.5kg/arm (including hand mass (E/E)) | |
Cleanliness | ISO Class 3 (ISO-14644) | |
Mass | 32kg | |
Facilities | Vacuum | -80kPag or less, 10NL/min |
Power supply | 3 Phases 200-230±10% VAC 15A | |
Environment | Temperature | 0-40℃ |
Humidity | 70% or less (No condensation) |
※1 Transfer performance differs from the standard when options are added.
Q&A - Frequently Asked Questions -