Expanded lineup of vacuum wafer transfer robots

Featured article in Nikkan Kogyo Shimbun “Handotai Sangyo (Semiconductor Industry)” (published July 12, 2022).

• - “UT-VDX3000” ultrahigh-precision, low-vibration type
• - “UT-VDW3000” ultrahigh-speed transfer type, contributing to improvements in semiconductor productivity
• - “UTVW-R2800H” compatible with high-temperature process equipment

Including the above, we will continue to expand our lineup of high-value-added vacuum transfer robots, and contribute to the evolution and development of the semiconductor industry.