Special issue of "SEMICON Japan 2023" (December 7, 2023) published in the Electronic Device Industry Newspaper.

The UT-VSW3000 Series is a space-saving device,

• Space saving of equipment
  The horizontally articulated arm enables wafer transfer within a square transfer module in which process modules can be installed in parallel, thus saving space in vacuum equipment compared to conventional circular transfer modules.
• High speed, low vibration, and high accuracy
  High-speed, low-vibration, high-precision transfer is realized by direct drive motor drive without transfer reducer.
• Ultra-high vacuum
  Magnetic fluid is not used due to the use of a bulkhead vacuum seal.

We will contribute to the evolution and development of the semiconductor industry by working to improve productivity per unit area through measures such as the following